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  june 2010 doc id 17614 rev 1 1/17 1 TDA2004R 10 + 10 w stereo amplifier for car radio features low distortion low noise protection against: ? output ac short circuit to ground ? overrating chip temperature ? load dump voltage surge ? fortuitous open ground ? very inductive loads description the TDA2004R is a class b dual audio power amplifier in multiwatt1 1 package specifically designed for car radio applications. power booster amplifiers can be easily designed using this device that provides a high current capability (up to 3.5 a) and can drive very low impedance loads (down to 1.6 ). the TDA2004R allows very compact applications because few external components are required and it doesn't need electrical insulation between the package and the heatsink. multiwatt11 table 1. device summary order code package packing TDA2004R multiwatt11 tube www.st.com
contents TDA2004R 2/17 doc id 17614 rev 1 contents 1 pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 application suggestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1 built-in protection systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.1 load dump voltage surge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.2 short circuit (ac condition) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1.3 polarity inversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1.4 open ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1.5 inductive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1.6 dc voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1.7 thermal shut-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
TDA2004R list of tables doc id 17614 rev 1 3/17 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 5. recommended values of the component of the application circuit. . . . . . . . . . . . . . . . . . . 12 table 6. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
list of figures TDA2004R 4/17 doc id 17614 rev 1 list of figures figure 1. pins connection diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3. printed circuit board and components layout of the figure 2. . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. quiescent output voltage vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. quiescent drain current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 6. distortion vs. output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 7. output power vs. supply voltage, r l = 2 and 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 figure 8. output power vs. supply voltage, r l = 1.6 and 3.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 figure 9. distortion vs. frequency, r l = 2 and 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 figure 10. distortion vs. frequency, r l = 1.6 and 3.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 figure 11. supply voltage rejection vs. c3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 12. supply voltage rejection vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 13. supply voltage re jection vs. c2 and c3, g v = 390/1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 figure 14. supply voltage re jection vs. c2 and c3, g v = 1000/10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 figure 15. gain vs. input sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 16. total power dissipation and efficiency vs. output power (r l = 2 ) . . . . . . . . . . . . . . . . . . 11 figure 17. total power dissipation and efficiency vs. output power (r l = 3.2 ) . . . . . . . . . . . . . . . . 11 figure 18. maximum allowable power dissipation vs. ambient temperature . . . . . . . . . . . . . . . . . . . . 11 figure 19. suggested lc network circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 20. voltage gain bridge configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 21. multiwatt11 mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
TDA2004R pins description doc id 17614 rev 1 5/17 1 pins description figure 1. pins connection diagram (top view) 1 2 3 4 5 6 7 9 10 11 8 bootstrap(1) input-(1) svrr gnd input-(2) input+(2) output(2) +v s output(1) input+(1) tab connected to pin 6 d95au318 bootstrap(2)
electrical specifications TDA2004R 6/17 doc id 17614 rev 1 2 electrical specifications 2.1 absolute maximum ratings 2.2 thermal data 2.3 electrical characteristics refer to the stereo application circuit t amb = 25 c; g v = 50 db; r th(heatsink) = 4 c/w unless otherwise specified table 2. absolute maximum ratings symbol parameter value unit v s operating supply voltage 18 v dc supply voltage 28 peak supply voltage (50 ms) 40 io (1) 1. the max. output current is internally limited. output peak current (non repetitive t = 0.1 ms) 4.5 a output peak current (repetitive f 10 hz) 3.5 p tot power dissipation at t case = 60 c 30 w t stg , t j storage and junction temperature -40 to 150 c table 3. thermal data symbol parameter value unit r th-j-case thermal resistance junction-to-case max 3 c/w table 4. electrical characteristics symbol parameter test condition min. typ. max. unit v s supply voltage 8 18 v v o quiescent offset voltage v s = 14.4 v v s = 13.2 v 6.6 6 7.2 6.6 7.8 7.2 v v i d total quiescent drain current v s = 14.4 v v s = 13.2 v - 65 62 120 120 ma ma p o output power (each channel) f = 1 khz; thd = 10 % v s = 14.4 v; r l = 4 v s = 14.4 v; r l = 3.2 v s = 14.4 v; r l = 2 v s = 14.4 v; r l = 1.6 6 7 9 10 6.5 8 10 11 -w
TDA2004R electrical specifications doc id 17614 rev 1 7/17 p o output power (each channel) f = 1 khz; thd = 10 % v s = 13.2 v; r l =3.2 v s = 13.2 v; r l = 1.6 v s = 16 v; r l = 2 6 9 6.5 10 (1) 12 -w thd total harmonic distortion f = 1 khz; v s = 14.4 v; r l = 4 ; p o = 50 mw to 4 w; -0.21 % f = 1 khz; v s = 14.4 v; r l = 2 ; p o = 50 mw to 6 w; -0.31 % f = 1 khz; v s = 13.2 v; r l = 3.2 ; p o = 50 mw to 3w; -0.21 % f = 1khz; v s = 13.2v; r l = 1.6 ; p o = 40mw to 6w; -0.31 % ct cross talk v s = 14.4 v; v o = 4 v rms ; r g = 5 k ; r l = 4 ; f = 1 khz f = 10 khz 50 40 60 45 - mw mw v i input saturation voltage - 300 - mw r i input resistance f = 1 khz 70 200 - k f l low frequency roll off (-3 db) r l = 4 r l = 2 r l = 3.2 r l = 1.6 -- 35 50 40 55 hz f h high frequency roll off (-3 db) r l = 1.6 to 4 15 - - khz g v open loop voltage gain f = 1 khz - 90 - db closed loop voltage gain f = 1 khz 48 50 51 g v closed loop gain matching - - 0.5 - db e n total input noise voltage r g = 10 k (2) -1.55 v svr supply voltage rejection v ripple = 0.5 vrms; f ripple =100 hz; r g = 10 k ; c 3 = 10 f 35 45 - db efficiency f = 1 khz; v s = 14.4 v; r l = 4 ; p o = 6.5 w; r l = 2 ; p o = 10 w; -70 60 -% f = 1 khz; v s = 13.2 v; r l = 3.2 ; p o = 6.5 w; r l = 1.6 ; p o = 10 w; -70 60 -% t j thermal shutdown junction temperature - - 145 - c 1. 9.3 w without bootstrap. 2. bandwidth filter: 22 hz to 22 khz. table 4. electrical characteristics (continued) symbol parameter test condition min. typ. max. unit
electrical specifications TDA2004R 8/17 doc id 17614 rev 1 2.4 test and application circuit figure 2. test and application circuit figure 3. printed circuit board and components layout of the figure 2 input (l) input (r) 120 k 1.2 k +v s r l r l + ? + ? c1 c3 c4 c5 3v 1/2 tda 2004r 1/2 tda 2004r 5 93 7 8 4 10 v 2.2f c12 0.1f 10 f 100 f 0.1 f 220 f 10 v c10 c8 r2 33 1 r3 r6 2200 f 1.2 k c6 c7 11 10 2 6 10 v 100 f 0.1 f 220 f 10 v c11 c9 r4 33 1 r5 r7 2200 f c2 3v 1 2.2f
TDA2004R electrical specifications doc id 17614 rev 1 9/17 2.5 electrical characteristics curves figure 4. quiescent output voltage vs. sup- ply voltage figure 5. quiescent drain current vs. supply voltage figure 6. distortion vs. output power figure 7. output power vs. supply voltage, r l = 2 and 4 figure 8. output power vs. supply voltage, r l = 1.6 and 3.2 figure 9. distortion vs. frequency, r l = 2 and 4 v o (v) 8 5 6 7 4 10 12 14 16 v s (v) 08 i d (ma) 100 80 60 40 20 10 12 14 16 v s (v) 08 d (%) 2 4 6 8 0 0.01 0.1 1 p o (w) f = 1 khz g v = 50 db v s = 13.2 v r l = 1.6 v s = 14.4 v r l = 2 v s = 13.2 v r l = 3.2 v s = 14.4 v r l = 4 v s (v) p o (w) 15 12 9 6 3 0 8 10 12 14 16 f = 1 khz g v = 50 db d = 10 % r l = 2 r l = 4 v s (v) p o (w) 15 12 9 6 3 0 8 10 12 14 16 f = 1 khz g v = 50 db d = 10 % r l = 1.6 r l = 3.2 d (%) 1.2 0.8 0.4 10 f (hz) 10 2 10 3 10 4 v s = 14.4 v g v = 50 db p o = 2.5 w r l = 2 p o = 2.5 w r l = 4
electrical specifications TDA2004R 10/17 doc id 17614 rev 1 figure 10. distortion vs. frequency, r l = 1.6 and 3.2 figure 11. supply voltage rejection vs. c3 figure 12. supply voltage rejection vs. frequency figure 13. supply voltage rejection vs. c2 and c3, g v = 390/1 figure 14. supply voltage rejection vs. c2 and c3, g v = 1000/10 figure 15. gain vs. input sensitivity d (%) 1.2 0.8 0.4 10 f (hz) 10 2 10 3 10 4 v s = 13.2 v g v = 50 db p o = 2.5 w r l = 1.6 p o = 2.5 w r l = 3.2 svr (db) 10 20 50 60 40 30 10 12 c 3 (f) 13 v s = 14.4 v f ripple = 100 khz v ripple = 0.5 v g v = 50 db r g = 10 k svr (db) 20 40 30 50 60 10 10 2 10 3 f (hz) r g = 0 r g = 10 k v s = 14.4 v g v = 50 db c 3 = 10 f svr (db) 50 40 30 20 10 20 c 3 (f) 12 5 v s = 14.4 v r l = 4 r g = 10 k g v = 390/1 f ripple = 100 hz c 2 = 220 f c 2 = 22 f c 2 = 5 f svr (db) 50 40 30 20 10 20 c 3 (f) 12 5 v s = 14.4 v r l = 4 r g = 10 k g v = 1000/10 f ripple = 100 hz c 2 = 220 f c 2 = 22 f c 2 = 5 f g v (db) 54 50 46 42 38 34 30 20 50 26 22 10 100 100 200 500 300 v i (mv) v s = 14.4 v f = 1 khz r l = 4 p o = 6 w p o = 0.5 w 30 g v 2468 2468
TDA2004R electrical specifications doc id 17614 rev 1 11/17 figure 16. total power dissipation and efficiency vs. output power (r l = 2 ) figure 17. total power dissipation and efficiency vs. output power (r l = 3.2 ) figure 18. maximum allowable power dissipa- tion vs. ambient temperature p tot (w) 10 60 40 20 12 (%) 2 4 6 8 20 24 p o (w) 8 41216 v s = 14.4 v r l = 4 f = 1 khz g v = 50 db p tot p tot (w) 60 40 20 6 (%) 2 4 10 12 p o (w) 4 268 v s = 13.2 v r l = 3.2 f = 1 khz g v = 50 db p tot p tot (w) 32 28 24 20 -50 50 100 t amb (?c) 0 16 12 8 4 0 r th = 8?c/w r th = 4?c/w r th = 2?c/w infinite heatsink
application suggestion TDA2004R 12/17 doc id 17614 rev 1 3 application suggestion the recommended values of the components are those shown on application circuit of figure 2 . different values can be used; the following table can help the designer. 3.1 built-in protection systems 3.1.1 load dump voltage surge the TDA2004R has a circuit which enables it to withstand voltage pulse train, on pin 9, of the type shown in figure 20 . if the supply voltage peaks to more than 40 v, then an lc filter must be inserted between the supply and pin 9, in order to assure that the pulses at pin 9 will be held within the limits shown. a suggested lc network is shown in figure 19 . with this network, a train of pulses with amplitude up to 120 v and width of 2 ms can be applied at point a. this type of protection is on when the supply voltage (pulse or dc) exceeds 18 v. for this reason the maximum operating supply voltage is 18 v. table 5. recommended values of the component of the application circuit component recommended value purpose larger than smaller than r r1 120 k optimization of the output signal symmetry smaller p omax smaller p omax r2, r4 1 k closed loop gain setting (1) increase of gain decrease of gain r3, r5 3.3 decrease of gain increase of gain r6, r7 1 frequency stability danger of oscillation at high frequency with inductive load c1, c2 2.2 f input dc decoupling high turn-on delay high turn-on pop, higher low frequency cutoff. increase of noise c3 10 f ripple rejection increase of svr, increase of the switch-on time degradation of svr c4, c6 100 f bootstrapping - increase of distortion at low frequency c5, c7 100 f feedback input dc decoupling -- c8, c9 0.1 f frequency stability - danger of oscillation c10, c11 1000 to 2200 f output dc decoupling - higher low-frequency cut-off 1. the closed loop gain must be higher than 26 db.
TDA2004R application suggestion doc id 17614 rev 1 13/17 figure 19. suggested lc network circuit figure 20. voltage gain bridge configuration 3.1.2 short circuit (ac condition) the TDA2004R can withstand a permanent short- circuit from the output to ground caused by a wrong connection during normal working. 3.1.3 polarity inversion high current (up to 10 a) can be handled by the device with no damage for a longer period than the blow-out time of a quick 2 a fuse (normally connected in series with the supply). this feature is added to avoid destruction, if during fitting to the car, a mistake on the connection of the supply is made. 3.1.4 open ground when the ratio is in the on condition and the ground is accidentally opened, a standard audio amplifier will be damaged. on the TDA2004R protection diodes are included to avoid any damage. 3.1.5 inductive load a protection diode is provided to allow use of the TDA2004R with inductive loads. 3.1.6 dc voltage the maximum operating dc voltage for the TDA2004R is 18 v. however the device can withstand a dc voltage up to 28 v with no damage. this could occur during winter if two batteries are series connected to crank the engine. from supply line l = 2mh a c to pin 3000 f 16v v s (v) 40 t1 t1 = 50ms t2 = 1000ms t2 t 14.4
application suggestion TDA2004R 14/17 doc id 17614 rev 1 3.1.7 thermal shut-down the presence of a thermal limiting circuit offers the following advantages: 1. an overload on the output (even if it is permanent), or an excessive ambient temperature can be easily withstood. 2. the heatsink can have a smaller factor of safety compared with that of a conventional circuit. there is no device damage in the case of excessive junction temperature: all that happens is that p o (and therefore p tot ) and i d are reduced. the maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); figure 18 shows the power dissipation as a function of ambient temperature for different thermal resistance.
TDA2004R package information doc id 17614 rev 1 15/17 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 21. multiwatt11 mechanical data and package dimensions outline and mechanical data 0016035 h dim. mm inch min. typ. max. min. typ. max. a50.197 b 2.65 0.104 c1.60.063 d 1 0.039 e 0.49 0.55 0.019 0.022 f 0.88 0.95 0.035 0.037 g 1.45 1.7 1.95 0.057 0.067 0.077 g1 16.75 17 17.25 0.659 0.669 0.679 h1 19.6 0.772 h2 20.2 0.795 l 21.9 22.2 22.5 0.862 0.874 0.886 l1 21.7 22.1 22.5 0.854 0.87 0.886 l2 17.4 18.1 0.685 0.713 l3 17.25 17.5 17.75 0.679 0.689 0.699 l4 10.3 10.7 10.9 0.406 0.421 0.429 l7 2.65 2.9 0.104 0.114 m 4.25 4.55 4.85 0.167 0.179 0.191 m1 4.73 5.08 5.43 0.186 0.200 0.214 s 1.9 2.6 0.075 0.102 s1 1.9 2.6 0.075 0.102 dia1 3.65 3.85 0.144 0.152 multiwatt11 (vertical)
revision history TDA2004R 16/17 doc id 17614 rev 1 5 revision history table 6. document revision history date revision changes 18-jun-2010 1 initial release.
TDA2004R doc id 17614 rev 1 17/17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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